Chen BAI, Ph.D. student Department of Computer Science and Engineering The Chinese University of Hong Kong Supervisor: Professor Bei Yu

BIOGRAPHY

I am currently a second-year Ph.D. student at the Department of Computer Science and Engineering of The Chinese University of Hong Kong under the supervision of Prof. Bei Yu and co-supervised by Prof. Martin D.F. Wong. Previously, I received my B.Eng. from The University of Electronic Science and Technology of China (UESTC) in 2020.

CONTACT

• Email: baichen318 [at] gmail.com
  

RESEARCH INTERESTS

• Design Space Exploration

• Software & Hardware Co-design

EDUCATION

• Ph.D. Computer Science and Engineering, The Chinese University of Hong Kong, Aug. 2020 -

• B.Eng. Software Engineering, The University of Electronic Science and Technology of China, Sep. 2016 - Jul. 2020

PUBLICATION

• [C5] Qi Sun, Chen Bai, Tinghuan Chen, Hao Geng, Xinyun Zhang, Yang Bai, Bei Yu, “Fast and Efficient DNN Deployment via Deep Gaussian Transfer Learning”, IEEE International Conference on Computer Vision (ICCV), Oct. 11-17, 2021. (paper) (slides) (poster)

• [C4] Zhuolun He, Ziyi Wang, Chen Bai, Haoyu Yang, Bei Yu, “Graph Learning-Based Arithmetic Block Identification”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Nov. 1–4, 2021. (paper) (slides)

• [C3] Chen Bai, Qi Sun, Jianwang Zhai, Yuzhe Ma, Bei Yu, Martin D.F. Wong, "BOOM-Explorer: RISC-V BOOM Microarchitecture Design Space Exploration Framework", IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Nov. 1–4, 2021. (William J. McCalla Best Paper Award) (paper) (slides)

• [C2] Jianwang Zhai, Chen Bai, Binwu Zhu, Yici Cai, Qiang Zhou, Bei Yu, “McPAT-Calib: A Microarchitecture Power Modeling Framework for Modern CPUs”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Nov. 1–4, 2021. (paper) (slides)

• [C1] Qi Sun, Chen Bai, Hao Geng, Bei Yu, "Deep Neural Network Hardware Deployment Optimization via Advanced Active Learning", IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Feb. 01–05, 2021. (paper)(slides)

EXPERIENCE

• Huawei Hong Kong Research Center, Hong Kong SAR, Jul. 2021 - present
  Research Intern, HiSilicon CPU design team
  Topic: CPU design space exploration & Power modeling

• SenseTime, Beijing, P.R. China, Oct. 2019 - Apr. 2020
  Research Intern, Intelligent Video Generation Group
  Topic: Deep Learning for Talking Face

• Intel Asia-Pacific R. & D. Center, Shanghai, P.R. China, Feb. 2019 - Jul. 2019
  Engineering Intern, Web Runtime Optimization Group
  Topic: Optimization of Chrome for IA (i.e., Intel Architecture) Chromebooks

• Visiting Student, University of Maryland, Washington, D.C., U.S.A., Jul. 2018 - Aug. 2018
  Topic: Participate leadership-related courses, School of Public Policy

TEACHING

• 2022 Spring: CENG3420 Computer Organization and Design

• 2021 Spring: CENG3420 Computer Organization and Design

• 2020 Fall: ENGG1110E Problem Solving By Programming

SELECTED AWARDS AND HONORS

• William J. McCalla ICCAD Best Paper Award, The IEEE Council on Electronic Design Automation (CEDA) and the ACM Special Interest Group on Design Automation (ACM SIGDA), 2021

• Full Postgraduate Scholarship, The Chinese University of Hong Kong, 2020 - 2024

• Outstanding Graduate, The Education Department of Sichuan Province, 2020

• Excellent Thesis Award, The University of Electronic Science and Technology of China, 2020

• National Scholarship, Ministry of Education, 2017 - 2018

• National Scholarship, Ministry of Education, 2016 - 2017

• Meritorious Winner of Interdisciplinary Contest on Modeling (ICM), COMAP, INFORMS, SIAM, MAA, ASA, AMS, 2018