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Chen BAI, Ph.D. student |
I am currently a fourth-year Ph.D. student at the Department of Computer Science and Engineering of The Chinese University of Hong Kong under the supervision of Prof. Bei Yu and co-supervised by Prof. Martin D.F. Wong. Previously, I received my B.Eng. from The University of Electronic Science and Technology of China (UESTC) in 2020.
Computer Architecture & Computer Systems
Electronic Design Automation (EDA)
Ph.D. Computer Science and Engineering, The Chinese University of Hong Kong, Aug. 2020 -
B.Eng. Software Engineering, The University of Electronic Science and Technology of China, Sep. 2016 - Jul. 2020
[C12] Yuan Pu, Tinghuan Chen, Zhuolun He, Chen Bai, Haisheng Zheng, Yibo Lin, Bei Yu, “IncreMacro: Incremental Macro Placement Refinement”, ACM International Symposium on Physical Design (ISPD), Taipei, Mar. 12–15, 2024. (Best Paper Candidate)
[C11] Shixin Chen, Su Zheng, Chen Bai, Wenqian Zhao, Shuo Yin, Yang Bai, Bei Yu, “SoC-Tuner: An Importance-guided Exploration Framework for DNN-targeting SoC Design”, IEEE/ACM Asian and South Pacific Design Automation Conference (ASPDAC), South Korea, Jan. 22–25, 2024.
[C10] Chen Bai, Xuechao Wei, Youwei Zhuo, Yi Cai, Hongzhong Zheng, Bei Yu, Yuan Xie, “Klotski: DNN Model Orchestration Framework for Dataflow Architecture Accelerators”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Francisco, Oct. 29–Nov. 02, 2023. (paper) (
slides) (
poster) (
video)
[C9] Ziyang Yu, Chen Bai, Shoubo Hu, Ran Chen, Taohai He, Mingxuan Yuan, Bei Yu, Martin Wong, “IT-DSE: Invariant Risk Minimized Transfer Microarchitecture Design Space Exploration”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Francisco, Oct. 29–Nov. 02, 2023. (paper) (
slides)
[C8] Chen Bai, Jiayi Huang, Xuechao Wei, Yuzhe Ma, Sicheng Li, Hongzhong Zheng, Bei Yu, Yuan Xie, “ArchExplorer: Microarchitecture Exploration Via Bottleneck Analysis”, IEEE/ACM International Symposium on Microarchitecture (MICRO), Toronto, Oct. 28–Nov. 01, 2023.
(
slides) (
code)
[C7] Chen Bai*, Sicheng Li*, Xuechao Wei, Bizhao Shi, Yen-Kuang Chen, Yuan Xie, “2022 ICCAD CAD Contest Problem C: Microarchitecture Design Space Exploration”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Diego, Oct. 30–Nov. 3, 2022.
(Invited Paper) (paper)
[C6] Ziyi Wang, Chen Bai, Zhuolun He, Guangliang Zhang, Qiang Xu, Tsung-Yi Ho, Bei Yu, Yu Huang, “Functionality Matters in Netlist Representation Learning”, ACM/IEEE Design Automation Conference (DAC), San Francisco, CA, Jul. 10–14, 2022. (paper) (
slides)
[C5] Qi Sun, Chen Bai, Tinghuan Chen, Hao Geng, Xinyun Zhang, Yang Bai, Bei Yu, “Fast and Efficient DNN Deployment via Deep Gaussian Transfer Learning”, IEEE International Conference on Computer Vision (ICCV), Oct. 11-17, 2021. (paper) (
slides) (
poster)
[C4] Zhuolun He, Ziyi Wang, Chen Bai, Haoyu Yang, Bei Yu, “Graph Learning-Based Arithmetic Block Identification”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Nov. 1–4, 2021. (paper) (
slides)
[C3] Chen Bai, Qi Sun, Jianwang Zhai, Yuzhe Ma, Bei Yu, Martin D.F. Wong, "BOOM-Explorer: RISC-V BOOM Microarchitecture Design Space Exploration Framework", IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Nov. 1–4, 2021. (William J. McCalla Best Paper Award) (paper) (
slides) (
video) (
code)
[C2] Jianwang Zhai, Chen Bai, Binwu Zhu, Yici Cai, Qiang Zhou, Bei Yu, “McPAT-Calib: A Microarchitecture Power Modeling Framework for Modern CPUs”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Nov. 1–4, 2021. (paper) (
slides)
[C1] Qi Sun, Chen Bai, Hao Geng, Bei Yu, "Deep Neural Network Hardware Deployment Optimization via Advanced Active Learning", IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Feb. 01–05, 2021. (paper) (
slides)
[J4] Chen Bai, Qi Sun, Jianwang Zhai, Yuzhe Ma, Bei Yu, Martin D.F. Wong, “BOOM-Explorer: RISC-V BOOM Microarchitecture Design Space Exploration”, accepted by ACM Transactions on Design Automation of Electronic Systems (TODAES). (paper)
[J3] Su Zheng, Hao Geng, Chen Bai, Bei Yu, Martin Wong, “Boosting VLSI Design Flow Parameter Tuning with Random Embedding and Multi-objective Trust-region Bayesian Optimization”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 28, no. 05, pp. 1–23, 2023. (paper)
[J2] Ziyi Wang, Zhuolun He, Chen Bai, Haoyu Yang, Bei Yu, “Efficient Arithmetic Block Identification with Graph Learning and Network-flow”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 42, no. 08, pp. 2591–2603, 2023. (paper)
[J1] Jianwang Zhai, Chen Bai, Binwu Zhu, Yici Cai, Qiang Zhou, Bei Yu, “McPAT-Calib: A RISC-V BOOM Microarchitecture Power Modeling Framework”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 42, no. 01, pp. 243–256, 2023.
(paper)
Alibaba DAMO Academy, Beijing, P.R. China, Jun. 2022 -
Research Intern, Computing Technology Lab
Topic: Chip agile design methodology & Next-generation computing substrate
Huawei Hong Kong Research Center, Hong Kong SAR, Jul. 2021 - Apr. 2022
Research Intern, Turing Core & Key Technologies Development Department, HiSilicon HK
Topic: Microprocessor design space exploration & Power modeling
SenseTime, Beijing, P.R. China, Oct. 2019 - Jul. 2020
Research Intern, Intelligent Video Generation Group
Topic: SenseAR DigitalHuman — Audio-Driven Virtual Human (China Daily)
Intel Asia-Pacific R. & D. Center, Shanghai, P.R. China, Feb. 2019 - Jul. 2019
Engineering Intern, Web Runtime Optimization Group
Topic: Chrome browser optimization for Intel architecture-based Chromebooks
University of Maryland, Washington, D.C., U.S.A., Jul. 2018 - Aug. 2018
Visiting Student, School of Public Policy
Topic: Study of "Leadership, Innovation, and Decision Making"
2020 Fall: ENGG1110E Problem Solving By Programming
ICCAD Student Scholar Program Travel Support Grant, Futurewei, CEDA, and SIGDA, 2023
MICRO 2023 Student Travel Grants, TCuARCH and ACM SIGMICRO, 2023
William J. McCalla ICCAD Best Paper Award, The IEEE Council on Electronic Design Automation (CEDA) and the ACM Special Interest Group on Design Automation (ACM SIGDA), 2021
Full Postgraduate Scholarship, The Chinese University of Hong Kong, 2020 - 2024
Outstanding Graduate, The Education Department of Sichuan Province, 2020
Excellent Thesis Award, The University of Electronic Science and Technology of China, 2020
National Scholarship, Ministry of Education, 2017 - 2018
National Scholarship, Ministry of Education, 2016 - 2017
Meritorious Winner of Interdisciplinary Contest on Modeling (ICM), COMAP, INFORMS, SIAM, MAA, ASA, AMS, 2018
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)
ACM Transactions on Design Automation of Electronic Systems (TODAES)
IEEE Transactions On Very Large Scale Integration (VLSI) Systems (TVLSI)
IEEE Design & Test (D&T)
2022, 2023 ACM/IEEE Design Automation Conference (DAC)
2022 ACM/IEEE International Conference on Computer-Aided Design (ICCAD)
2022, 2023 ACM/IEEE Asia and South Pacific Design Automation Conference (ASPDAC)
2022 ACM/IEEE Workshop on Machine Learning for CAD ((MLCAD)